VENUE

 
 
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Via Sponsorship will be held at the University of Strathclyde’s Technology and Innovation Centre. The TIC is Strathclyde's world-class research hub, revolutionising collaboration between academia, industry and the public sector.  Their flagship facility offers dedicated conference and events facilities all year round.

Technology and Innovation Centre
University of Strathclyde
99 George Street
Glasgow
G1 1RD

 
 
 
 
 
 

VIA Sponsorship is supported by: